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MSIG at Flexible Sensors 2016
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When: Tuesday, April 26, 2016
9:00 AM

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Fab to plastic to paper: a realistic roadmap for flexible sensors? 

With the advent of smart phones and game controllers in 2007, and more recently with a plethora of other CE devices, wearables and now the Internet of Everything/Things (IoE/T), sensors are experiencing unprecedented growth. Forecasts for sensor demand are as high as 100 trillion by 2030. This presentation will outline some of these growth drivers and focus on what lies ahead for new forms of delivery vehicles for MEMS and sensors beyond today's fab based components. Flexible, hybrid and printed sensors will provide some alternatives in the next few years, but what will drive ultra-high volumes and lower costs in the next decade? The future IoE/T landscape will require deployment of printed electronics, antennas, power sources, transistors and sensors to enable multiple orders of magnitude cost reduction per square meter. Stretchable plastic and thin film substrates and ultimately roll-to-roll printing on paper will serve various application, cost, performance and form factor needs. A call to action to the industry will also be proposed to ensure challenges are addressed to realize the opportunities.


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