Home   |   Newsletter   |   Print Page   |   Contact Us   |   Sign In   |   Join Now
2016 FLEX Conference (Flexible & Printed Electronics Conference & Exhibition)
Tell a Friend About This EventTell a Friend
2016 FLEX Conference (Flexible & Printed Electronics Conference & Exhibition)

2/29/2016 to 3/3/2016
When: 2/29/2016
Where: Monterey Marriott
350 Calle Principal
Monterey 93940
United States
Presenter: FlexTech Alliance

« Go to Upcoming Event List  

Plan now to attend 2016FLEX Conference & Exhibition. Spend several productive days seeing and hearing the latest breakthroughs and developments in Flexible, Printed and Hybrid Electronics. Join other electronics professionals as they gather to explore bringing technology and products successfully to market through presentations, courses, exhibits and networking.

Now in its 15th year, the Flex Conference will again commence on the beautiful Monterey Peninsula on California’s Pacific coastline. Monterey brings the fun and intimacy of the resort-setting to the professional and technology development focus of the event. Business and pleasure mix well in this beautiful location. 

Passes are available for any combination of days, courses or events. Pick and choose items that work for your schedule and interests, while leaving plenty of time to meet with new customers and vendors also at the event. 

Don’t miss the best technical event in the industry – guaranteed to advance your technical and business interests in flexible, printed, hybrid electronics and their applications.


Join Chief Strategy Officer Stephen Whalley as he presents his talk, "Fab to Plastic to Paper: A Realistic Roadmap for Flexible Sensors?" 

With the advent of smart phones and game controllers in 2007, and more recently with a plethora of other CE devices, wearables, and now the Internet of Everything/Things (IoE/T), sensors are experiencing unprecedented growth.  Forecasts for sensor demand are as high as 100 trillion by 2030.  This presentation will outline some of these growth drivers and focus on what lies ahead for new forms of delivery vehicles for MEMS and sensors beyond today's fab based components.  Flexible, hybrid and printed sensors will provide some alternatives in the next few years, but what will drive ultra-high volumes and lower costs in the next decade?  The future IoE/T landscape will require deployment of printed electronics, antennas, power sources, transistors and sensors to enable multiple orders of magnitude cost reduction per square meter.  Stretchable plastic and thin film substrates and ultimately roll-to-roll printing on paper will serve various application, cost, performance and form factor needs.  A call to action to the industry will also be proposed to ensure challenges are addressed to realize the opportunities.


Click here to register!


Membership Software Powered by YourMembership  ::  Legal